Silicon Carbide Ceramic
Silicon carbide (Sic) is a micro-hole structure, in the same unit area can be more than 30% of the porosity, greatly increasing the contact with the air cooling area, enhance its cooling effect.
This series ceramics have been widely used in petroleum, chemical, automotive, mechanical and aerospace industries because of their excellent resistance to thermal shock, high temperatures, oxidation and chemical corrosion.It can also shield electromagnetic interference in electronic products.
Feature:
1,Low thermal expansion, 2,High thermal conductivity;
3,Low density, High strength; 4,Superior chemical inertness;
5,Excellent thermal shock resistance;
6,High hardness, High elastic modulus;
7,Isolated wave absorption performance.
Application:
1,LED-TV LCD-T 2,Notebook
3,M/B(Mother board 4,Power Transistor
5,Power Module 6,Chip IC MOS IGBT
7,Network/ADSL
| PROPERTIES PARAMETERS |
| Item | Unit | Value | Testing Standards 1 | Testing Standards 2 |
| Color | | Light Green | / | / |
| Specific gravity | G/cm3 | 1.9 | / | / |
| Porosity | % | >30 | GB/T 3810.3-2006 | ASTM C 373 |
| Volume Density | G/cm3 | 1.7~1.9 | GB/T 3810.3-2006 | ASTM C 373 |
| BET Surface Area | Cm2/g | 464629 | BET (V-Sorb 2800 P) | / |
| BJH adsorption average pore diameter | Nm | 11.10 | BET (V-Sorb 2800 P) | / |
| Pore volume | Cm3/g | 0.12 | BET (V-Sorb 2800 P) | / |
| Mechanical Properties |
| Mohs Hardness | Mohs | 5~6 | DIN EN101-1992 | / |
| Flexural Strength | MPa | >90 | GB/T 14389-14390 | ASTM C 1674-08 |
| Water Absorption | % | >15 | ASTM D 570-98 | / |
| Thermal conductivity | W/mk | > 9 | HOT DISK | ISO-DIS22007-2.2 |
| Thermal Diffusivity | Mm2/s | 2.80 | HOT DISK |
| Specific Heat | MJ/ m3K | 2.62 | HOT DISK |
| Linear Thermal Expansion Coefficient | 10-6m/ºC | 4.02@ RT~300ºC | GB/T 16920-1997 | ASTM C 372 |
| Maximum Operate Temperature | ºC | < 700 | | |
| Material Properties |
| Silicon carbide | % | 90 | | |
Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd. Was founded in 2010, a total investment of more than 1000000 RMB. Jia RiFeng Tai is a professional committed to the domestic and foreign electronic thermal insulation materials of high-tech enterprises.
Our Main Products: Thermal conductive filler material, like thermal gap pad, insulator silicone sheet, insulator silicone sleeve, ACF conductive film, thermal silicone heating, thermal double-sided tape, thermal graphite, thermal silicone encapsulants, thermal grease / paste, alumina ceramic, Aln ceramic, zirconia ceramic, Sic ceramic, NFC Ferrite sheet, EMI absorber sheet, thermal phase change material, silicone rubber (Fujipoly), Bergquist thermal conductive material K4, K6, K10 insulation gap pad.
Products are widely used in power supply, LED lighting, electric welding machine, notebook computer, LED decorative lighting, set-top box, high power supply and other industries. At present, the company has passed ISO 9001, RoHS and UL certifications.
High quality, good price, delivery on time and sincere service are our value and promises to our customer. As an enterprise, we are confident enough to present competitive products to severe competition. If you are interested in our products, please do not hesitate to contact us.
